3D patterning/etching, 3D metallization, multi-layer circuits, HTCC—- Customized 3D packaging service

Beside traditional flat plane patterning, Walthy is experienced of 3D surface metallization and patterning on diversified substrates, the complete facilities, process and engineering experience helps many new designs come true.

3D surface patterning

Another challenge is to make circuits or components smaller and more complex, which requires multi-layers such as HTCC circuits or circuits on more planes of the substrates.

Circuits on full surfaces of substrate

Micro holes connections for multi-layer circuits (sidewall metallization and metal fully filled (TGV,TSV))

HTCC components

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