Laser fine cutting of thin film, metal, ceramics, silicon wafer

* Material: any material, including all kinds of metal, alloys, and non metal material, especially hard and brittle material such as silicon, glass, sapphire, and ceramics, as well as flexible material such as PET film, flexible PCB, all kinds of plastics.

* Material thickness: 0~2mm

* Min pattern size: 0.01mm(depends on thickness and shape)

* Could be any shapes: circles, triangle, retangle, hexagon, polygon or any shape in CAD

* Tolerance: 5~20um depends on dimension

 

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