Semiconductor packaging substrate custom manufacturing— glass, ceramics, silicon and metals

Nowadays, more and more different materials are applied to semiconductor packaging, beside traditional silicon, silicon carbide and other semiconductor materials. We are experienced to provide customized substrate for this application, customized size and thickness of different material such as glass, quartz for MEMS, ceramics for membrance circuits, and all kinds of metail for new packaging methods.

Silicon, silicon carbide, GaN:

medical-chip-substrate

700um thick silicon chips with metal coated

Transparent materials Glass/sapphire/quartz:

glass-substrate-on-tape

Glass chip @ 3mm*3mm*0.4mm

img_1813 Sapphire substrate:30*0.8*0.4mm

Ceramcis: Alumina, AlN, Ferrite

au-coated-ceramics-circuits

AlN substrate with Au coated

Metals: SUS steel, tungsten, molybdenum, copper, alloys,etc

molybdenum-substrate

Tungsten chips with sharp edge and corner under microscope

metal-substrate-cut

Molybdenum substrates for semiconductor packagin

metal-substrate-cut-on-tape

Metal squares on tape (before expanding)

packaging-substate-cutting

Steel chips after little expanding

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