Nowadays, more and more different materials are applied to semiconductor packaging, beside traditional silicon, silicon carbide and other semiconductor materials. We are experienced to provide customized substrate for this application, customized size and thickness of different material such as glass, quartz for MEMS, ceramics for membrance circuits, and all kinds of metail for new packaging methods.
Silicon, silicon carbide, GaN:
700um thick silicon chips with metal coated
Transparent materials Glass/sapphire/quartz:
Glass chip @ 3mm*3mm*0.4mm
Sapphire substrate:30*0.8*0.4mm
Ceramcis: Alumina, AlN, Ferrite
AlN substrate with Au coated
Metals: SUS steel, tungsten, molybdenum, copper, alloys,etc
Tungsten chips with sharp edge and corner under microscope
Molybdenum substrates for semiconductor packagin
Metal squares on tape (before expanding)
Steel chips after little expanding
