We could supply fast solution on prototyping, research or production of metallization on various substrates to make circuits, which could be used in optical communication, optoelectronic devices, electric vehicle and other microelectronic fields. Our metallization is characterized by excellent adhesion, stability and resistance against high temperatures.
We are able to deposit the metallization on almost all kind of substrates, and the most standard ones are ceramics including Alumina, Alumina Nitride, Sapphire, Diamond, Silicon Nitride, Ferrite, Glass and Silicon etc
Standard Multi-layer Metallization:
Gold Metallization on both sides and patterning
Some Standard Metal Layers: Ti/Pt/Au, TiW/Au, Ti/Cu/Ni/Au, Ti/Cu/Ni/Pd/Au, TiW/Ni/Au, TiW/Cu/Ni/Au
Gold thickness ranging from 0.1um to 10um
Line width:min 10um with +/-1um
Vias or filled vias
Laser Machining Holes and Machined Features
Other metallizations and thicknesses are available, please contact us for more information.
Metallization patterns on sapphire wafer
Diamond metallization chips
